Core Technologist, Wire Saw Subject Matter Expert (Hemlock, MI, US, 48626)

<p style="text-align:center;margin:0.0in;font-size:10.0pt;font-family:&#39;Times New Roman&#39;, serif"><a name="_Hlk202264346"></a></p> <p><span style="font-family:verdana, geneva, sans-serif"><strong>Advertisement</strong></span></p> <p><span style="font-family:verdana, geneva, sans-serif"><strong> </strong></span></p> <p><span style="font-family:verdana, geneva, sans-serif">Solar Technology LLC seeks Core Technologist, Wire Saw Subject Matter Expert to work in Hemlock, MI. Serve as technical expert to support wire saw operations &amp; wafer slicing processes. Use diamond-coated wire saw to slice silicon wafers &amp; improve solar wafer products. Identify opportunities for process optimization &amp; drive process developments to improve yield, reduce costs, &amp; enhance efficiency of solar wire saw operations &amp; processes. Troubleshoot technical issues to identify root causes &amp; implement corrective actions. Train engineers, technicians, &amp; operators on solar wire saw operations. Req: bachelor’s in mechanical engineering, materials science, or chemical engineering, or closely related. 5 yrs. exp.: using diamond wire saw process to slice silicon wafers. 5 yrs. exp: working on diamond wire saw process equipment &amp; determining technical issues to produce high quality wafers; troubleshooting &amp; problem-solving issues w/ diamond wire saw equipment; &amp; working w/ diamond wire quality &amp; wire saw equipment components to understand the impact on wire saw process &amp; wafer quality. Send resume referencing “2772” to Cassandra Tuckey at <a href="mailto:careers@corning.com">careers@corning.com</a> or One Riverfront Plaza, Corning, NY 14831.</span></p> <p> </p> <p><span style="font-family:verdana, geneva, sans-serif">Rate of Pay: $157,000/year </span></p>