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College Intern - Job Description Metrology, Defect Inspection, and Data Analytics for Die-to-Wafer Hybrid Bonding

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What you’ll work on

Full posting
  • Support metrology and defect inspection application development and testing.

  • Analyze measurement and inspection data to evaluate system performance.

  • Develop scripts and software tools for data processing, visualization, and automation.

From the employer’s posting
Key responsibilities include: Support metrology and defect inspection application development and testing. Analyze measurement and inspection data to evaluate system performance.
Support metrology and defect inspection application development and testing. Analyze measurement and inspection data to evaluate system performance. Develop scripts and software tools for data processing, visualization, and automation.
Analyze measurement and inspection data to evaluate system performance. Develop scripts and software tools for data processing, visualization, and automation. Apply image processing techniques for defect analysis and characterization.

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  • At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

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About Applied Materials

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world.

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Job description

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Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We Offer Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. The intern will support the development and validation of overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system. The role involves engineering data analysis, image processing, and development of software utilities to improve measurement, inspection, and workflow efficiency. Key responsibilities include: Support metrology and defect inspection application development and testing. Analyze measurement and inspection data to evaluate system performance. Develop scripts and software tools for data processing, visualization, and automation. Apply image processing techniques for defect analysis and characterization. Prepare technical reports and collaborate with cross-functional engineering teams. Additional Information Time Type: Full time Employee Type: Intern / Student Travel: No Relocation Eligible: No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. The intern will support the development and validation of overlay metrology and defect inspection applications for a die-to-wafer hybrid bonding cluster system. The role involves engineering data analysis, image processing, and development of software utilities to improve measurement, inspection, and workflow efficiency. Key responsibilities include:
Work authorization
No Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
Status in our records
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First seen by us
Sep 1, 2026
Recorded sightings
97
Last seen by us
Oct 8, 2026

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