Internship - Software Developer with AI/ML Focus for Chip-Package-Board CoDesign (f/m/div)

#WeAreIn to create tiny chips and big careers. Are you ready to take the first step in your career? Let's shape the future together! Whether you join as a student, intern, or trainee, you'll be part of something real - real projects, real impact, and real opportunities to grow. Are you in? Your role Key responsibilities in your new role Collaboration: Partner with the Chip‑Package‑Board CoDesign team to design, implement, test, and maintain software that supports semiconductor design processes AI Integration: Apply artificial intelligence and machine learning algorithms to automate and improve Electronic Design Automation workflows and CoDesign methodologies Development: Build solutions in Python, Java, and Cadence SKILL within the Electronic Design Automation environment for advanced semiconductor design challenges Data Analysis: Examine workflow data to identify optimization opportunities and implement data‑driven improvements using artificial intelligence and machine learning approaches Tooling:  Create utilities that embed artificial intelligence and machine learning optimizations for simulation, design validation, and testing Quality:  Take part in code reviews, maintain high‑quality documentation, and define test plans to ensure robust software Learning: Grow proficiency in Cadence SKILL to address CoDesign challenges and contribute new ideas by staying current with software, artificial intelligence and machine learning, and Electronic Design Automation trends Further Information: Type of employment: Temporary / Part-time / Full-time (flexible working hours from Monday to Friday between 6 a.m. and 7 p.m.) Duration: Minimum 12 months Your profile Qualifications and skills to help you succeed  Education: Active student in Computer Science, Artificial Intelligence, Electrical Engineering, or a related technical field Programming: Experience developing software with Python, Java, and Perl Frameworks: Familiarity with artificial intelligence and machine learning frameworks, including concepts such as algorithms, data preprocessing, and model deployment Cadence SKILL:  Interest in learning and applying Cadence SKILL to create EDA solutions Methods: Knowledge of Agile ways of working, version control systems such as Git, and project management tools such as Jira Soft Skills: Strong analytical thinking and problem‑solving abilities; able to work independently and in cross‑functional teams Language Skills: English required; German is a plus Additional information This position is subject to the collective agreement for workers and employees in the electrical and electronics industry (full-time), employment group B for bachelor students, employment group D for master students (https://www.feei.at/wp-content/uploads/2026/06/minimum-salaries-white-collar-workers-2026-05-01.pdf ). #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.  Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon. Ramona Steiner