Back to jobs

Staff/Senior Engineer -Package Health System and Analytics

Fab 10A, Singapore

Pay
Salary not listed in the saved posting
Work setup
Unconfirmed
Employment
Unconfirmed
Apply at Micron

What you’ll work on

Full posting
  • Define quantitative package health metrics

  • Implement real-time defect detection and classification (critical vs.

  • Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes.

From the employer’s posting
Package Health Metrics & Monitoring Define quantitative package health metrics Develop detection mechanisms and monitoring dashboards for continuous health assessment.
Inline Defect Characterization Implement real-time defect detection and classification (critical vs. non-critical). Conduct next-level characterization for critical defects and integrate findings into predictive models.
Advanced Analytics & Knowledge Base Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes.

What you’ll bring

All qualifications

Core experience

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
  • Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes
  • 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
  • Experience with AI/ML tools or statistical modeling.
  • Strong understanding of semiconductor packaging process, material interaction and properties.
  • Ability to work cross-functionally with process, equipment, and reliability teams.

Preferred experience

  • Proficiency in Python/R for data analysis and visualization is a plus
Qualification wording
Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field.
Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes
3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.
Experience with AI/ML tools or statistical modeling.
Strong understanding of semiconductor packaging process, material interaction and properties.
Ability to work cross-functionally with process, equipment, and reliability teams.
Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus

Tools in this posting

  • R
  • Python
Source — Tool mentions in context
- 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. - Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus - Experience with AI/ML tools or statistical modeling.

Job description

View original posting ↗

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions

Key Responsibilities 

  • Package Health Metrics & Monitoring

    • Define quantitative package health metrics

    • Develop detection mechanisms and monitoring dashboards for continuous health assessment.

    • Perform electrical and mechanical characterization of packages. 

  • Inline Defect Characterization

    • Implement real-time defect detection and classification (critical vs. non-critical).

    • Conduct next-level characterization for critical defects and integrate findings into predictive models.

  • Advanced Analytics & Knowledge Base

    • Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes.

    • Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes.

  • End-to-End Traceability

    • Collaborate with process and equipment engineers to establish traceability across wafer, assembly, and test stages.

    • Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures.
       

  • AI Responsibilities
    Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
    Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
     


Qualifications 

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. 

  • 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. 

  • Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus

  • Experience with AI/ML tools or statistical modeling. 

  • Strong understanding of semiconductor packaging process, material interaction and properties. 

  • Ability to work cross-functionally with process, equipment, and reliability teams.

  • Knowledge of defect inspection systems and inline metrology.

  • Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking).

  • Strong problem-solving and documentation skills  

  • Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes
     

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Your next step

  • Have your CV and examples of relevant work ready.
  • Check the listed location, eligibility and core experience before starting.
  • Ask the employer about the salary range before committing time to the process.

Complete your application on micron.wd1.myworkdayjobs.com. The employer’s form will show what is required.

Already applied? Track this application

Source & posting history

View original posting ↗

Source notes

Source excerpts

Selected passages from the saved posting. Check the full description for conditions and exceptions.

Pay

No pay amount identified in the saved description.

Location & working pattern

Fab 10A, Singapore

- Knowledge of defect inspection systems and inline metrology. - Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking). - Strong problem-solving and documentation skills
Work authorization

No clear work-authorization passage found. Eligibility is unconfirmed.

Status in our records
Active
First seen by us
Apr 15, 2026
Recorded sightings
212
Last seen by us
Oct 8, 2026

These dates show when we found the listing. Check the employer’s website to confirm it is still accepting applications.

Report an error

See how this role fits your experience

Add your resume to compare the role’s scope, tools and requirements with your experience.

Find answers in the posting

AI
How answers work

AI selects complete passages from this posting. Check them for conditions and exceptions.

Uses this posting and your question. No profile needed.