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Staff/Senior Engineer -Package Health System and Analytics

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What you’ll bring

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Preferred experience

  • Proficiency in Python/R for data analysis and visualization is a plus
Qualification wording
* Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus
Education & alternatives
Qualifications * Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. * 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering.

Tools in this posting

  • R
  • Python
Source — Tool mentions in context
* 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. * Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus * Experience with AI/ML tools or statistical modeling.

Job description

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Req. ID: JR94588 Staff/Senior Engineer -Package Health System and Analytics (Evergreen) Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Package Health Analyst will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions Key Responsibilities * Package Health Metrics & Monitoring * Define quantitative package health metrics * Develop detection mechanisms and monitoring dashboards for continuous health assessment. * Perform electrical and mechanical characterization of packages. * Inline Defect Characterization * Implement real-time defect detection and classification (critical vs. non-critical). * Conduct next-level characterization for critical defects and integrate findings into predictive models. * Advanced Analytics & Knowledge Base * Perform correlation and causation studies between process variables, defect patterns, and reliability outcomes. * Build and maintain a structured knowledge base for package health learnings to enable NPI handover and future technodes. * End-to-End Traceability * Collaborate with process and equipment engineers to establish traceability across wafer, assembly, and test stages. * Develop data pipelines and tools for linking process parameters, equipment signals, and defect signatures. * AI Responsibilities Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Qualifications * Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. * 3+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. * Strong data analytics and statistical modeling skills. Proficiency in Python/R for data analysis and visualization is a plus * Experience with AI/ML tools or statistical modeling. * Strong understanding of semiconductor packaging process, material interaction and properties. * Ability to work cross-functionally with process, equipment, and reliability teams. * Knowledge of defect inspection systems and inline metrology. * Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking). * Strong problem-solving and documentation skills * Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes Job Profile(s): Product Development Engineer 3 - Product Development Engineer 4 Relocation level: (TBD) Before Getting Started Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that: * Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence. * If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process. ​​​​ As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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* Knowledge of defect inspection systems and inline metrology. * Familiarity with advanced packaging technologies (HBM, hybrid bonding, 2.5D/3D stacking). * Strong problem-solving and documentation skills
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First seen by us
Jun 1, 2026
Recorded sightings
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Last seen by us
Oct 8, 2026

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